1. Zewei Yuan, Zhuji Jin, Renke Kang andQuan Wen.Tribochemical polishing CVD diamond film with FeNiCr alloy polishingplate prepared by MA-HPS technique. Diamond & Related Materials, 2012, 21, pp.50-57.
2. Zewei Yuan, Zhuji Jin, Quan Wen and KunWang. Polishing CVD diamond wafer by compound methods. International Journal ofMachining and Machinability of Materials, 2012.1.
3. Z.J. Jin, Z.W. Yuan, Q. Li and K.Wang. TribologicalAspects of Chemical Mechanical Polishing Diamond surfaces. Key EngineeringMaterials, 2011,325, pp. 464-469.
4.Heng Zhen Dai, ZhuJi Jin, Shang Gao, Z.C. Tao. Research on the Chemical-Mechanical Grinding (CMG)Tools for Al2O3 Ceramic. Advanced Materials Research,2011, 325, pp 270-275.,
5. Wei Si Li, DongMing Guo, Zhu Ji Jin, Zhe Wang, Ze Wei Yuan. Effects of High DielectricConstant Abrasives on ECMP, Applied Mechanics and Materials, 2011, 121-126, pp3263-3267
9. Guo Dongming, XuChi, Kang Renke and Jin Zhuji. Model analysis and experimental investigation ofthe friction torque during the CMP process, Journal of Semiconductors, 2011,32(3), 036002.
10. Wang Cailing, KangRenke, Jinzhuji and Guo Dongming. Effects of the reciprocating parameters ofthe carrier on material removal rate and non-uniformity in CMP. Journal ofSemiconductors, 2010, 31(12), 126001.
11. Xu Chi, GuoDongming, Jin Zhuji, Kang Renke. A signal processing method for thefriction-based endpoint detection system of a CMP process. Journal ofSemiconductors, 2010, 31(12), 126002.
14. Jin ZJ, Yuan ZW, Kang RK and Dong BX.Fabrication and Characterization of FeNiCr Matrix-matrix-TiC composite forpolishing CVD diamond film. Journal of Material Science and Technology, 2009,25(3), pp 319-324.
15. Z.J.Jin, Z.W.Yuan, R.K.Kang andB.X.Dong. Study on two kinds of grinding wheels for dynamic friction polishingof CVD diamond film, Key Engineering Materials, 2009, 389-390, pp 217-222.
16. MA Xingwei, JINZhuji, YAN Shi, XU Jiujun. Effect of La2O3 onmicrostructure and high-temperature wear property of hot-press sintering FeAlintermetallic compound. JOURNAL OF RARE EARTHS, 2009, 27(6), pp 1031-1036.
18. Z. W. Yuan, Z. J. Jin, B. X. Dong andR. K. Kang. Polishing of free-standing CVD diamond films by the combination ofEDM and CMP. Advanced Materials Research, 2008, 53-54, pp 111-118.
19. Z.J. Jin, X.W. Ma and Z.W. Yuan. Thehigh-efficient low-cost wheel-grinding technology for CVD diamond films,Advanced Materials Research, 2007, 24-25, pp 295-302.
20. F.W. Huo, Z.J.Jin,R.K.Kang, D.M.Guo. A method for grinding mode indentification in grinding ofsilicon wafers. Adwance Materials Research. 2007, 24-25, pp 255-230.
21. F.W. Huo, Z.J.Jin,et al. Experimental investigation of brittle to ductile transition of singlecrystal silicon by single grain grinding. Key Engineering Materials. 2007, 329,pp 433-438.
23. J.Y.Liu, Z.J.Jin,D.M.Guo, R.K. Kang. Effects of suspending abrasives on the lubricationproperties of slurry in chemical mechanical polishing of silicion wafer. KeyEngineering Materials, 2006, 304-305, pp 359-363.
24. J.Y.Liu, D.M.Guo,Z.J.Jin, R.K. Kang. A suspeding abrasives and porous pad model for the analysisof lubrication in chemical mechanical polishing, Key Engineering Materials,2006, 315-316. pp 775-778.