王守緒:男，電子科技大學教授。1986年吉林大學化學系大學畢業進入電子科技大學工作至今，教授，碩士研究生導師。1990年-1993年四川大學在職研究生學習，獲理學碩士學位。
主要研究方向有：新型電子材料合成及套用、納米材料合成及套用、先進印製電路製造材料及工藝等。作為研究團隊的核心成員參與完成了國家自然基金、廣東省產學研合作、四川省產學研合作等項目10餘項。開發出新型鋁電解電容器電解液添加劑、新型相變儲能材料等與材料，在印製電路製造材料及工藝方法進行了長期有效的工作，所獲的重大科學技術成果“高密度互連混合集成印製電路關鍵技術及產業化”獲得2014年度國家科技進步獎二等獎、“HDI印製電路板關鍵技術研發及套用”獲得2011年教育部科技進步一等獎，同時還獲得了四川省、教育部頒發的省部級科技進步二等獎兩項。獲得授權國家發明專利15項，發表論文50餘篇。
基本介紹
- 中文名：王守緒
- 國籍：中國
- 民族：漢
- 出生日期：1964年9月
- 職業：教授
- 畢業院校：吉林大學化學系
- 主要成就：獲電子科技大學教學成果獎3項
研究領域,學術成果,
研究領域
教育背景
1990.09－1993.06四川大學大學，無機化學專業，碩士學位；
1982.09－1986.06 吉林大學大學，無機化學專業，學士學位；
研究方向:新型電子材料合成及套用、納米材料合成及套用、先進印製電路製造材料及工藝等
研究內容:新型電子材料合成及套用
主要研究具有特殊光、電、磁性能的新型電子材料的合成，如矽酸鹽基質發光材料的合成、導電聚苯胺合成、特殊形貌與性能氧化銅顆粒的製備、相變儲能材料製備及套用、新型燃料電池技術等；
研究內容:納米材料合成及套用
主要研究納米材料性能與電子材料、器件性能等之間的作用規律、納米材料的新合成技術等。如納米溶膠製備及對電解電容器性能的影響、固相反應法與水熱法製備納米材料、分子自組裝技術及功能薄膜製備等
研究內容3:先進印製電路製造材料及工藝等
主要研究印製電路板製造及性能檢測先進技術、開發其套用工藝並與企業合作實現工業化套用等。如印製電路板精細線路製作技術、高密度高可靠層間互連技術、印製電路板與電子元器件集成技術、柔性電子產品製作材料及技術等；
研究條件
（1）在珠海和梅州建有電子薄膜與集成器件國家重點實驗室珠海分室、電子薄膜與集成器件國家重點實驗室梅州研發中心，用於全國最先進、最齊全的印製電路板研發及生產設備。
（2）建有電子科技大學印製電子研發中心、電子科技大學—LPKF印製電路工藝聯合實驗室，擁有全國第一條集教學、科研於一體的印製電路生產工藝線，包括數字雕刻機、DES製造線、層壓機、磨板機、電鍍銅線、照相底版製作系統、磨拋機、金相顯微鏡等。
（3）擁有數字源表、LCR電橋、導熱分析儀、拉力測試機、FT-IR分析儀、CHI及AUTOLAB電化學工作站以及學校共用的SEM、XRD等大型測試設備等。
學術成果
發表相關研究論文50餘篇，獲得授權發明專利15項；
代表性論文
1.Chen, Yuanming; Lin, Jianhui; Qiu, Tianyang; He, Wei; Silberschmidt, Vadim V.; Wang, Shouxu; Tan, Ze. Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition. Materials Letters, v 139, p 458-461, January 15, 2015
2. Wang, Chong; Xiang, Lin; Chen, Yuanming; Wang, Shouxu; Xiao, Dingjun; He, Wei. Study on brown oxidation process with imidazole group, mercapto group and heterocyclic compounds in printed circuit board industry. Journal of Adhesion Science and Technology, v 29, n 12, p 1178-1189, june 2015
3.Ji, Linxian; Wang, Chong; Wang, Shouxu; He, Wei; Xiao, Dingjun; Tan, Ze. Multiphysics coupling simulation of RDE for PCB manufacturing. Circuit World, v 41, n 1, p 20-28, February 2, 2015
4.Chen, Yuanming；Gao, Xing; Wang, Jinling; He, Wei; Silberschmidt, Vadim V.; Wang, Shouxu; Tao, Zhihua; Xu, Huan. Properties and application of polyimide-based composites by blending surface functionalized boron nitride nanoplates. Journal of Applied Polymer Science, v 132, n 16, April 1, 2015
5. Wang, Shouxu; Feng, Li; Chen, Yuanming; He, Wei; Tao, Zhihua; Chen, Shijing; Xu, Huan. UV laser cutting of glass-epoxy material for opening flexible areas of rigid-flex PCB.Circuit World, v 40, n 3, p 85-91, July 1, 2014
6.Chen, Yuanming; Wang, Shouxu; He, Xuemei; He, Wei; Silberschmidt, Vadim V.; Tan, Ze. Copper coin-embedded printed circuit board for heat dissipation: Manufacture, thermal simulation and reliability. Source: Circuit World, v 41, n 2, p 55-60, May 5, 2015
7. Yang, Xiaojian; He, Wei; Wang, Shouxu; Zhou, Guoyun; Tang,Yao. Synthesis and characterization of Ag nanorods used for formulating high-performance conducting silver ink. Journal of Experimental Nanoscience, v 9, n 6, p 541-550, July 2014
8.Chen, Yuanming; He, Wei; Zhou, Guoyun; Hu, Yongsuan; Wang, Shouxu; Tao, Zhihua. Preparation and thermal effects of polyarylene ether nitrile aluminium nitride composites. Polymer International, v 63, n 3, p 546-551, March 2014
9.Tang, Yao; He, Wei; Wang, Shouxu; Tao, Zhihua; Cheng, Lijuan. The superiority of silver nanoellipsoids synthesized via a new approach in suppressing the coffee-ring effect during drying and film formation processes. Nanotechnology, v 25, n 12, March 28, 2014
10. Tang, Yao; He, Wei; Wang, Shouxu; Tao, Zhihua; Cheng, Lijuan. One step synthesis of silver nanowires used in preparation of conductive silver paste.Journal of Materials Science: Materials in Electronics, v 25, n 7, p 2929-2933, July 2014
11.Chen, Yuanming; He, Wei; Chen, Xianming; Wang, Chong; Tao, Zhihua; Wang, Shouxu; Zhou, Guoyun; Moshrefi-Torbati, Mohamed. Plating uniformity of bottom-up copper pillars and patterns for ic substrates with additive-assisted electrodeposition. Electrochimica Acta, v 120, p 293-301, February 20, 2014
12.Yang, Xiaojian; He, Wei; Wang, Shouxu; Zhou, Guoyun; Tang, Yao. Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resin. Journal of Materials Science: Materials in Electronics, v 23, n 1, p 108-114, January 2012, Featured Issue: Lead-Free Solder and Packaging
13.Yang,Xiaojian; He,Wei;Wang,Shouxu;Zhou, Guoyun;Tang,Yao. Preparation of high-performance conductive ink with silver nanoparticles and nanoplates for fabricating conductive films. Materials and Manufacturing Processes, v 28, n 1, p 1-4, 2013
14. Tang, Yao; He, Wei; Zhou, Guoyun; Wang, Shouxu; Yang, Xiaojian; Tao, Zhihua; Zhou, Juncheng. A new approach causing the patterns fabricated by silver nanoparticles to be conductive without sintering. Nanotechnology, v 23, n 35, September 7, 2012
15.Yang, Xiaojian; He, Wei; Wang, Shouxu; Zhou, Guoyun; Tang, Yao; Yang, Juanhong. Effect of the different shapes of silver particles in conductive ink on electrical performance and microstructure of the conductive tracks. Journal of Materials Science: Materials in Electronics, v 23, n 11, p 1980-1986, November 2012
16.Tao, Zhihua; He, Wei; Wang, Shouxu; Zhou, Guoyun. Electrochemical study of cyproconazole as a novel corrosion inhibitor for copper in acidic solution. Industrial and Engineering Chemistry Research, v 52, n 50, p 17891-17899, December 18, 2013
17.Yang, Xiaojian; He, Wei; Wang, Shouxu; Zhou, Guoyun; Tang, Yao; Yang, Juanhong. Erratum: Effect of the different shapes of silver particles in conductive ink on electrical performance and microstructure of the conductive tracks. Journal of Materials Science: Materials in Electronics, v 23, n 11, p 1987, November 2012
18.Zhou, Guoyun; He, Wei; Wang, Shouxu; Chen, Chia-Yun; Wong, Ching Ping. Fabrication of a novel porous Ni-P thin-film using electroless-plating: Application to embedded thin-film resistor. Materials Letters, v 108, p 75-78, 2013
19.Zhou, Guoyun; He, Wei; Wang, Shouxu; Mo, Yunqi; Hu, Ke; He, Bo. A novel nitric acid etchant and its application in manufacturing fine lines for PCBs. IEEE Transactions on Electronics Packaging Manufacturing, v 33, n 1, p 25-30, January 2010
20.Yang, Ying; Wang, Shouxu; He, Wei; Hu, Ke; He, Bo; Mo, Yunqi. Preparation of ultra-fine copper powder and its application in manufacturing conductive lines by printed electronics technology. 2009 International Conference on Applied Superconductivity and Electromagnetic Devices, ASEMD 2009, p 131-132, 2009, 2009 International Conference on Applied Superconductivity and Electromagnetic Devices, ASEMD 2009
21.Yu, Xiaofei; He, Wei; Wang, Shouxu; Zhou, Guoyun; Zhu, Meng. Research on etching blind holes and desmear with plasma. Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, p 304-306, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011
22.Wang, Shouxu; Xie, Jianzhi. Synthesis of luminous material of SrO-TiO2-SiO2:Eu3+, Bi3+ by sol-gel method. Dianzi Keji Daxue Xuebao/Journal of University of Electronic Science and Technology of China, v 29, n 2, p 218-220, Apr 2000 ,Language: Chinese
23.He, Wei; Wang, Shouxu; Wang, Huixiu; Wang, Xieshu. Synthesis and application of nano organic silica sol. Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research, v 20, n 6, p 617-620, December 2006 Language: Chinese
