採用精煉、熔化鍛造、壓延加工或粉未冶金工藝製造的半導體器件、記錄媒體顯示器件等的配線和薄膜的貴金屬及其合金的濺射靶材。Au、Pt、Pd、Ag靶材用於積體電路和大規模積體電路,CoCrPt、CoPt和CoPd等合金靶材用於磁記錄。
定義
用例
名稱 | 尺寸 | 純度 |
金絲(Au) | Φ0.001mm—1.0mm | 99.99% 99.995% 99.999% |
金絲(Au) | Φ1.0mm—3.0mm | 99.99% 99.995% 99.999% |
金粒(Au) | Φ2*5mm or Φ2*10mm | 99.99% 99.995% 99.999% |
金粒(Au) | Φ3*3mm or Φ3*5mm | 99.99% 99.995% 99.999% |
金片(Au) | T 0.10mm—T 2mm | 99.99% 99.995% 99.999% |
金粉(Au) | 0.01um—1.0um 1-5um -200目 -325目 | 99.99% |
標準包裝為:100g 250g 500g 1000g 10kg 25kg 50kg |
名稱 | 尺寸 | 純度 | |
銀絲(Ag) | Φ0.2—1.0mm | 99.9% 99.99% 99.999% 99.9995+% 99.9999% 99.9999+% | |
Φ1.0—3.0mm | 99.9% 99.99% 99.999% 99.9995+% 99.9999% 99.9999+% | ||
Φ3.0—6.0mm | 99.9% 99.99% 99.999% 99.9995+% 99.9999% 99.9999+% | ||
銀片(Ag) | 50*50*(0.2-1.5)mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | |
100*100*(0.2-1.5)mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | ||
200*250*(0.2-1.5)mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | ||
銀棒(Ag) | Φ(10-152.4)*1000mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | |
Φ25.4*1000mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | ||
Φ50.8*500mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | ||
Φ76.2*200mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | ||
Φ101.6*200mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | ||
Φ127*200mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | ||
Φ152.4*200mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | ||
銀粒(Ag) | 1-10mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | |
Φ2*10mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | ||
Φ3*3mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | ||
Φ3*10mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | ||
Φ6*6mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | ||
Φ6*12mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | ||
銀塊(Ag) | 10-100mm | 99.9% 99.99% 99.999% 99.999+% 99.9999% 99.9999+% | |
銀粉(Ag) | 0.5-75um | 99.5%99.9%99.95%99.99% | |
標準包裝為:100g 250g 500g 1000g 10kg 25kg 50kg |