[1] Synthesis and Characterization of CNTs/Bi2Te3 Thermoelectric Nanocomposites. Int.J. Electrochem. Sci., 2013, (8): 6686 – 6691
[2] Electrodeposition of MWNT/Bi2Te3 Composite Thermoelectric Films. Journal of Elec Materi, 2013, 42:1936-1945
[3] Effect of MWNTs on the Electrochemical Reduction Processes of Bi3+, HTeO2+, and Their Mixtures. Journal of Elec Materi, 2013, 42:2073-2083
[4] Microstructure and thermoelectric properties of p-type Bi - Sb - Te - Se thin films prepared by electrodeposition method. Thin Solid Films, 2012, 520(7): 2474-2478
[5] Investigation on the Cu(II) and Co(II) Electrochemical Reduction Process in Citrate Solution by CV and EIS. Journal of The Electrochemical Society, 2012, 159 (6): D375-D381
[6] Electrodeposition of p-type BixSb2-xTey Thermoelectric Film from Dimethyl Sulfoxide Solution.Electrochimica Acta, 2010, 55(17): 5000-5005
[7] Electrodeposition of BixSb2-xTey Thermoelectric Films from DMSO Solution. Journal of Electronic Materials, 2010, 39(9): 1562-1565
[8] Studies on the electrochemical reduction processes of HTeO2+ by CV and EIS. Journal of Applied Electrochemistry, 2010, 40(11): 2005-2012
[9] Effect of Substrate on the Structure and Thermoelectric Properties of n-Type Bi2Te3_ySey Thin Films Prepared by Electrodeposition. Journal of Eelectric Materials, 2010, 39(9):1469-1475
[10] Adsorption Behavior and Related Mechanism of Janus Green B during Copper Via-Filling Process.JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2009, 156(4): D119-D124
[11] Invalidating Mechanism of Bis (3-sulfopropyl) Disulfide (SPS) During Copper Via-filling Process. APPLIED SURFACE SCIENCE, 2009, 255(8): 4389-4392
[12] Investigations on the Invalidated Process and Related Mechanism of PEG During Copper Via-filling Process. APPLIED SURFACE SCIENCE, 2009, 255(7): 3977-3982
[13] Studies of the Electrochemical Reduction Processes of Bi3, HTeO and Their Mixtures.APPLIED SURFACE SCIENCE, 2009, 255(16):7394-7402
[14] Investigations on the Electrodeposition Behaviors of Bi0.5Sb1.5Te3 Thin Film From Nitric Acid Baths. ELECTROCHIMICA ACTA, 2009, 54(14): 3745-3752
[15] Electrochemical Reduction Process of Sb(III) on Au Electrode Investigated by CV and EIS. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2009, 156(3):D84-D91
[16] Electrodeposition of BixSb2-xTey Thermoelectric Thin Films From Nitric Acid And Hydrochloric Acid Systems. APPLIED SURFACE SCIENCE, 2009, 255(7):4225-4231
[17] Effect of Clon the Adsorption-Desorption Behavior of PEG. J. Electrochem. Soc., 2008, 155(4): D263-D269.
[18] Effect of the Substrate on the Electrodeposition of Bi2Te3-ySey Thin Films. Materials Research Bulletin, 2008, 43(7): 1808-1813
[19] Electrodeposition of n-type Bi2Te3-ySey Thermoelectric Thin Films on Stainless Steel and Gold Substrates. APPLIED SURFACE SCIENCE, 2007, 253 (6): 3360-3365
[20] Effect of the Dispersibility of ZrO2 Nanoparticles in Ni-ZrO2 Electroplated Nanocomposite Coatings on the Mechanical Properties of Nanocomposite Coatings. APPLIED SURFACE SCIENCE,2006,252 (10): 3812-3817
[21] A New Type of Low Power Thermoelectric Micro-generator Fabricated by Nanowire Array Thermoelectric Materials. Microelectronic Engineering, 2005, 77(3-4):223-229.
[22] Fabrication and Characterization of Ni-ZrO2 Composite Nano-coatings by Pulse Electrodeposition. Scripta Materialia, 2005, 53:613-618
[23] Electrodeposition of Bismuth Telluride on Gold from Acidic Solutions. BULLETIN OF ELECTROCHEMISTRY, 2005, 21 (10): 471-479