寧圃奇，男，工學博士，中國科學院電工研究所副研究員。
基本介紹
基本資料,教育背景,工作履歷,學術方向,代表論著,
基本資料
教育背景
2004年畢業於清華大學電機系獲工學舟腿驗閥學士；
2006年畢業於清華大學電機系獲工學碩士學位；旬鑽定
2010年獲美國維吉尼亞理工大學電氣與計悼拔夜陵算機工程系工學博士學位。
工作履歷
2010－2013年在美國橡樹嶺國家實驗室從事功率模組封裝與高功率密度變頻器等方面的研究工作。
2013年加入中國科學院電工擊鑽研究所，任副研究員。
學術方向
（1）寬禁帶半導體前棕灑蘭沿探索；
（2）功率模組封裝新技術；
（3）高再估想寒殼達功率密度變頻器。
代表論著
[1]P. Ning, F. Wang, and K. D. T. Ngo, "Forced-Air Cooling System Design Under Weight Constraint for High-Temperature SiC Converter," IEEE Trans. on Power Electronics, Vol.29,issue 4, pp.1998-2007, April,2014
[2]P. Ning, Di Zhang, Rixin Lai, Dong Jiang, Fred Wang, Dushan Boroyevich, Rolando Burgos, Kamiar Karimi, Vikram Immanue, and Eugene Solodovnik, " Development of a 10 kW High Temperature, High Power Density Three-Phase AC-DC-AC SiC Converter," IEEE Industrial Electronics Magazine, Vol. 7, issue 1,pp. 6-17, March, 2013
[3]P. Ning, F. Wang, and K. Ngo, "Automatic Layout Design for Power Module," IEEE Trans. on Power Electronic, Vol. 28, issue 1, pp. 481-487, Jan, 2013.
[4]P. Ning, F. Wang, and K. Ngo, "High Temperature SiC Power Module Electrical Evaluation Procedure," IEEE Trans. on Power Electronics, Vol. 26, issue 11, pp. 3079-3083, Nov, 2011.
[5]P. Ning, G. Lei, F. Wang, G. Lu, K. Ngo, and K. Rajashekara, "A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module", IEEE Trans. on Power Electronics, Vol.25, issue 8, pp. 2059 – 2067, Aug, 2010.
[6]P. Ning, R. Lai, D. Huff, F. Wang, K. Ngo, K. Karimi, and V. Immanuel, "SiC Wirebond Multi-Chip Phase-Leg Module Packaging Design and Testing for Harsh Environment," IEEE Trans. on Power Electronics, Vol. 25, issue 1, pp. 16-23, Jan, 2010.
[6]P. Ning, R. Lai, D. Huff, F. Wang, K. Ngo, K. Karimi, and V. Immanuel, "SiC Wirebond Multi-Chip Phase-Leg Module Packaging Design and Testing for Harsh Environment," IEEE Trans. on Power Electronics, Vol. 25, issue 1, pp. 16-23, Jan, 2010.
