周永存 博士，副教授。2014年9月畢業於西安交通大學，獲工學博士學位。2012月至2014年於美國喬治亞理工學院(Georgia Tech)從事電子封裝複合材料的研究，師從“現代電子封裝之父”C. P. Wong 教授。2014年9月特評副教授進入西工大材料學院工作，主要從事聚合物基納米複合封裝材料及其相變機理研究。主持國家自然科學基金、陝西省自然科學基金面上項目、中央高校基礎研究基金以及國家重點實驗室開放課題等多項基金，已在國際期刊權威期刊上發表SCI論文30餘篇，包括Nature旗下綜合期刊Scientific Reports, Applied Physics Letter等，SCI他引600餘次，已授權發明專利5項。
基本介紹
- 中文名：周永存
- 畢業院校：西安電子科技大學
- 學位/學歷：博士
- 職業：教師
- 專業方向：聚合物基納米複合封裝材料及其相變機理
- 職稱：西北工業大學副教授
個人簡介,教育背景,工作經歷,學術兼職,科學研究,學術成果,論文,專利,
個人簡介
教育背景
2014.09畢業於西安交通大學微電子學與固體電子學專業獲工學博士學位
2012.12 - 2014.01美國喬治亞理工學院（Georgia Tech）
工作經歷
2014.9—至今西北工業大學材料學院副教授
學術兼職
美國化學學會(ACS)；光電材料器件網專家委員會專家委員；Composite Materials Research, Materials Science: Advanced Composite Materials 等期刊編委；IEEE會員；中國複合材料學會納米複合材料委員會委員
科學研究
主要從事的研究方向有：
（1）聚合物基電子封裝複合材料
（2）有機-無機相變儲能複合材料
（3）納米材料相變長大共生行為及其套用
學術成果
近幾年代表性成果：
論文
[1] Yongcun Zhou*, Siqi Wu, Feng Liu*. High-performance polyimide nanocomposites with polydopamine-coated copper nanoparticles and nanowires for electronic applications. Materials Letters, 2019, 237:19–21.
[2] Yongcun Zhou*, Shihu Yu, Huan Niu, Feng Liu*. Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires. Polymers, 2018, 10(12), 1412.
[3] Yongcun Zhou*, Xiao Zhuang, Feixiang Wu, Feng Liu*. High-Performance Thermal Management Nanocomposites: Silver Functionalized Graphene Nanosheets and Multiwalled Carbon Nanotube. Crystals, 2018, 8(11): 398.
[4] Yongcun Zhou, Feng Liu, Hong Wang*. Novel organic–inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review. Polymer Composites, 2017, 38(4):803-813.
[5] Yongcun Zhou, Feng Liu*. High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings. Applied Physics Letters, 2016, 109(8): 082901.
[6] Yongcun Zhou, Zhengping Luo, Xiao Zhuang, Feng Liu*. Multilayer-structured high-performance nanocomposites based on a combination of silver nanoparticles and nanowires. Materials Letters, 2016, 182: 323-327.
[7]Yongcun Zhou, Yagang Yao, Chia-Yun Chen, Kyoungsilk Moon, Hong Wang*, Ching-Ping Wong*. The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation. Scientific Reports, 2014, 4: 4779.
[8] Yongcun Zhou*, Yining Chen, Hong Wang*, Ching-Ping Wong. Creation of a multilayer aluminum coating structure nanoparticle polyimide filler for electronic applications. Materials Letters, 2014, 119: 64-67.
[9] Yongcun Zhou, Hong Wang*. An Al@Al2O3@SiO2/Polyimide composite with multilayer coating structure fillers based on self-passivated aluminum cores. Applied Physics Letters, 2013, 102(13): 132901.
[10]Yongcun Zhou, Yuanyuan Bai, Ke Yu, Yan Kang, Hong Wang*. Excellent thermal conductivity and dielectric properties of polyimide composites filled with silica coated self-passivated aluminum fibers and nanoparticles. Applied Physics Letters, 2013, 102(25): 252903.
[11] Yongcun Zhou, Lu Wang, Hu Zhang, Yuanyuan Bai, Hong Wang*. Enhanced high thermal conductivity and low permittivity of polyimide based composites by core-shell Ag@SiO2 nanoparticle fillers. Applied Physics Letters, 2012, 101(1): 012903.
[12] Yongcun Zhou, Hong Wang*, Lu Wang, Ke Yu, Zude Lin, Li He, Yuanyuan Bai. Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging. Materials Science and Engineering B, 2012, 177(11): 892-896.
[13]Yongcun Zhou, Hong Wang*, Feng Xiang, Hu Zhang, Ke Yu, Liang Chen. A poly(vinylidene fluoride) composite with added self-passivated microaluminum and nanoaluminum particles for enhanced thermal conductivity. Applied Physics Letters, 2011, 98(18): 182906.
[14] Xiao Zhuang, Yongcun Zhou*, Feng Liu*. A novel 3D sandwich structure of hybrid graphite nanosheets and silver nanowires as fillers for improved thermal conductivity. Materials Research Express, 2017, 4(1): 015018.
[15] Yuanyuan Bai, Yanhui Jiang, Baohong Chen, Choon Chiang Foo, Yongcun Zhou, Feng Xiang, Jinxiong Zhou, Hong Wang*, Zhigang Suo*. Cyclic performance of viscoelastic dielectric elastomers with solid hydrogel electrodes, Applied Physics Letters, 2014, 104(6): 062902.
[16] Yong Li, Longlong Shu, Yongcun Zhou, Jing Guo, Hong Wang*. Enhanced flexoelectric effect in a non-ferroelectric composite. Applied Physics Letters, 2013, 103(14): 142909.
[17] Ke Yu, Yuanyuan Bai, Yongcun Zhou, Yujuan Niu, Hong Wang*. Poly(vinylidene fluoride) polymer based nanocomposites with enhanced energy density by filling with polyacrylate elastomers and BaTio3 nanoparticles. Applied Physics Letters, 2014, 104(8): 082904.
[18] Ke Yu, Yujuan Niu, Yuanyuan Bai, Yongcun Zhou, Hong Wang*. Poly(vinylidene fluoride) polymer based nanocomposites with significantly reduced energy loss by filling with core-shell structured BaTiO3/SiO2 nanoparticles. Applied Physics Letters, 2013, 102(10): 102903.
[19] Ke Yu, Lu Wang, Yongcun Zhou, Yuanyuan Bai, Hong Wang*. Enhanced dielectric properties of BaTiO3/poly(vinylidene fluoride) nanocomposites for energy storage applications. Journal of Applied Physics, 2013, 113(3): 034105.
[20] Ke Yu, Yujuan Niu, Yongcun Zhou, Hong Wang*. Nanocomposites of surface-modified BaTiO3 nanoparticles filled ferroelectric polymer with enhanced energy density. Journal of the American Ceramic Society, 2013, 96(8): 2519-2524.
[21] Ke Yu, Yujuan Niu, Feng Xiang, Yongcun Zhou, Yuanyuan Bai, Hong Wang*. Enhanced electric breakdown strength and high energy density of barium titanate filled polymer nanocomposites. Journal of Applied Physics, 2013, 114(17): 174107.
專利
[1] 周永存, 吳思奇，甄誠，於是乎. 一種聚合物基電子封裝複合材料. 中國發明專利: 201811494536.8
[2] 周永存, 甄誠，吳思奇，於是乎. 一種聚合物基封裝複合材料的成型設備. 中國發明專利: 201811495615.0
[3] 周永存, 莊曉, 劉峰. 一種聚合物基納米複合材料及其製備方法. 中國發明專利: 2017111268026.4
[4] 汪宏, 周永存, 向鋒, 李可鋮, 喻科, 陳惠如. 聚合物基複合材料及其製造方法. 中國發明專利: zl 201110054346.6
[5] 向鋒, 汪宏, 李可鋮, 劉維紅, 喻科, 周永存. 一種核殼結構填料聚合物基複合材料及其製備方法. 中國發明專利：zl 200910218645.1
[6] 汪宏, 周永存, 向鋒, 喻科, 王魯. 一種聚合物基複合材料及其製備方法. 中國發明專利: 201210182048.x
[7] 汪宏, 喻科, 牛玉娟, 周永存, 陳惠如. 聚合物基複合材料及其製備方法. 中國發明專利: 201310115602.7
[8] 劉峰, 周永存, 羅正平, 莊曉. 一種聚合物基複合材料及其製備方法. 中國發明專利: 201610537556.3
