《先進聚醯亞胺材料》是一本2020年化學工業出版社出版的圖書，作者楊士勇（Shi-yong,Yang）主編，本書系統地介紹了先進聚醯亞胺材料的合成、性能和套用。
基本介紹
- 中文名：先進聚醯亞胺材料
- 作者：楊士勇（Shi-yong,Yang） 主編
- 出版社：化學工業出版社
- ISBN：9787122334985
內容簡介,圖書目錄,作者簡介,
內容簡介
先進聚醯亞胺材料，由於具有優異的耐熱性、綜合力學性能、電學性能和化學穩定性等，在航空、航天、微電子、平面顯示、電氣絕緣等高技術領域具有廣泛的套用前景。本書系統介紹了先進聚醯亞胺材料的合成、性能和套用。包括先進聚醯亞胺薄膜、先進聚醯亞胺纖維、碳纖維複合材料用樹脂基體、超級工程塑膠和泡沫材料、微電子用聚醯亞胺材料，還介紹了氣體分離膜、質子交換膜、可溶性和低k 值聚醯亞胺材料。本書可供化學工業、高分子材料、航空航天、微電子製造與封裝、平面顯示等領域的相關研究人員、工程師、研究生以及高年級的本科生參考使用。
圖書目錄
Preface ix
List of Contributors xi
About the Editor xii
Chapter 1 Advanced Polyimide Films 1
Shi-Yong Yang and Li-Li Yuan
1.1 Introduction 1
1.2 Chemistry of Polyimide Films 3
1.2.1 Thermal Imidization 3
1.2.2 Chemical Imidization 8
1.3 Thermal Curing of Polyimide Films 14
1.3.1 Thermal Imidization Process 14
1.3.2 Influence of Curing Temperatures on Film’s Properties 18
1.4 Structures and Properties of Polyimide Films 20
1.4.1 Advanced Polyimide Films 20
1.4.2 Low-CTE Polyimide Films 28
1.4.3 Transparent Polyimide Films 37
1.4.4 Atomic Oxygen-resistant Polyimide Films 47
1.5 Surface Modification of Polyimide Films 52
1.6 Applications of Polyimide Films 54
1.6.1 Electric Insulating Applications 54
1.6.2 Electronic and Optoelectronic Applications 56
1.6.3 Aerospace Applications 60
1.7 Summary 62
REFERENCES 62
Chapter 2 Advanced Polyimide Fibers 67
Qing-Hua Zhang, Jie Dong and De-Zhen Wu
2.1 Introduction 67
2.2 Synthesis of Spinning Resin Solutions 68
2.2.1 “Two-Step” Polymerization Method 68
2.2.2 “One-Step” Polymerization Method 70
2.3 Preparation of Polyimide Fibers 72
2.3.1 Wet-Spinning Method 72
2.3.2 Dry-Spinning Method 77
2.3.3 Other-Spinning Methods 81
2.4 Structure and Properties of Polyimide Fibers 82
2.4.1 Aggregation Structure of Polyimide Fibers 82
2.4.2 Chemical Structure-Property Relationship 84
2.4.3 Properties of Polyimide Fibers 87
2.5 Applications of Polyimide Fibers 89
2.5.1 Production of Polyimide Fibers 89
2.5.2 Application of Polyimide Fibers 89
2.6 Summary 91
REFERENCES 91
Chapter 3 Polyimide Matrices for Carbon Fiber Composites 94
Shi-Yong Yang and Mian Ji
3.1 Introduction 94
3.2 NA-endcapped Thermoset Matrix Resins 95
3.2.1 Chemistry 96
3.2.2 Structures and Properties 97
3.3 PE-endcapped Oligoimide Resins 107
3.3.1 Chemistry 107
3.3.2 Structures and Properties 108
3.4 Properties of Polyimide/Carbon Fiber Composites 122
3.4.1 Preparation of PMR-type Resin Prepregs 122
3.4.2 Fabrication of Carbon Fiber Composites 122
3.4.3 Properties of NA-Endcapped Polyimide Composites by Autoclave 123
3.4.4 Properties of PE-Endcapped Polyimide Composites by Autoclave 127
3.4.5 Properties of PE-Endcapped Polyimide Composites by RTM 130
3.5 Applications of Polyimide/Carbon Fiber Composites 132
3.6 Summary 134
Contents
REFERENCES 134
Chapter 4 Super Engineering Plastics and Foams 137
Shi-Yong Yang, Hai-Xia Yang and Ai-Jun Hu
4.1 Introduction 137
4.2 Compression-Molded Polyimide Materials 138
4.3 Injection and Extrusion Processed Polyimide Materials 139
4.4 Structures and Melt Processabilities of Aromatic Polyimide Resins 145
4.4.1 Polyimide Backbone Structures 145
4.4.2 Controlled Molecular Weights 147
4.5 Meltable Thermoplastic Polyimide Composites 150
4.6 Reactive End-Capped Meltable Polyimide Resins 153
4.6.1 NA-end-capped Meltable Polyimide Resins 154
4.6.2 PE-end-capped Meltable Polyimide Resins 159
4.7 Heat-Resistant Polyimide Foams 162
4.7.1 Introduction 162
4.7.2 Opened-Cell Soft Polyimide Foams 163
4.7.3 Closed-Cell Rigid Polyimide Foams 169
4.8 Thermally Stable Flexible Polyimide Aerogels 178
4.9 Summary 185
REFERENCES 185
Chapter 5 Polyimides for Electronic Applications 189
Qing-Hua Lu and Feng Zheng
5.1 Introduction 189
5.2 Polyimide Materials for Microelectronics 190
5.2.1 Combined Property Requirements 190
5.2.2 Typical Applications 192
5.2.3 Structures and Properties of Polyimide Materials for Microelectronics 195
5.3 Polyimide Materials for Optoelectric Planar Displays 206
5.3.1 Liquid Crystal Alignment Layers 206
5.3.2 Mechanical Rubbing Alignment Polyimides 207
5.3.3 Photoinduced Alignment PIs 208
5.3.4 The Microgroove Polyimide Surfaces 216
5.3.5 Langmuir–Blodgett Polyimide Films 217
5.4 Polyimide Materials for Optoelectronic Flexible Displays 217
5.4.1 Combined Property Requirements 217
5.4.2 Polyimides for Flexible Electronic Substrates 221
5.5 Polyimide Materials for Electronic Memories 226
5.5.1 Introduction 226
5.5.2 Polyimides for Resistive-type Memory Devices 229
5.5.3 Polyimides for Transistor-type Memory Devices 238
5.6 Summary 241
REFERENCES 242
Chapter 6 Polyimide Gas Separation Membranes 253
Xiao-Hua Ma and Shi-Yong Yang
6.1 Introduction 253
6.2 Mechanisms of Gas Separation and Testing Methods 255
6.2.1 Gas Transport Mechanism 255
6.2.2 Apparatus for Testing Gas Transport Properties 259
6.3 Structures and Properties of Polyimide Membranes 260
6.3.1 Isomer Structure Effects From Diamines 260
6.3.2 Substitution and Geometric Effects From Diamines 261
6.3.3 Chemical Structure Effects of Dianhydrides 270
6.4 Intrinsically Microporous Polyimide Membranes 276
6.5 Hydroxyl-functionalized Polyimide and Its Derived Polybenzoxazole Membranes 287
6.5.1 Hydroxyl-functionalized Polyimide Membranes 287
6.5.2 Thermally Rearranged Polybenzoxazole (TR-PBO) Membranes 294
6.5.3 Applications of TR-PBO Contents Membranes 301
6.6 Polyimide-Derived Carbon Molecular Sieve Membranes 301
6.6.1 Formation of CMSMs 301
6.6.2 Conversion From Polyimide to CMSMs 302
6.6.3 Structures and Properties of CMSMs 304
6.7 In Summary 314
REFERENCES 314
Chapter 7 Polyimide Proton Exchange Membranes 319
Jian-Hua Fang
7.1 Introduction 319
7.2 Monomer Synthesis 320
7.2.1 Synthesis of Sulfonated Diamines 320
7.2.2 Synthesis of Six-membered Ring Dianhydrides 329
7.3 Polyimide Preparations 330
7.3.1 Preparation From Sulfonated Diamines 330
7.3.2 Preparation From Sulfonated Dianhydrides 332
7.3.3 Synthesis via Postsulfonation 333
7.3.4 Block Copolymerization 334
7.4 Ion Exchange Membrane Properties 338
7.4.1 Solubility 338
7.4.2 Thermal Stability 340
7.4.3 Water Uptake and Swelling Ratios 340
7.4.4 Proton Conductivity 342
7.4.5 Water Resistance 344
7.4.6 Radical Oxidative Stability 356
7.4.7 Methanol Permeability 362
7.5 Fuel Cell Performance 364
7.6 Summary 371
REFERENCES 371
Chapter 8 Soluble and Low-k Polyimide Materials 376
Yi Zhang and Wei Huang
8.1 Introduction 376
8.2 Structures and Properties of Soluble Aromatic Polyimides 377
8.2.1 Soluble Polyimides With Flexible Backbones 377
8.2.2 Soluble Polyimides With Asymmetric Structures 379
8.2.3 Soluble Polyimides With Alicyclic Structures 380
8.2.4 Soluble Polyimides With Side Groups 382
8.3 Applications of Soluble Aromatic PIs 388
8.3.1 Second-order Nonlinear Optical (NLO) Materials 388
8.3.2 Memory Device Materials 392
8.3.3 Compensator Materials for Liquid Crystal Displays 397
8.3.4 Gas Separation Materials 398
8.3.5 Other Applications 398
8.4 Low-k Polyimide Materials 399
8.4.1 Introduction 399
8.4.2 Impact Factors on Dielectric Properties 400
8.4.3 Structures and Dielectric Properties of Polyimides 403
8.4.4 Low-k Polyimides With Porous Structures 404
8.4.5 Organic-Inorganic Hybrid Polyimide Materials 421
8.4.6 Intrinsic Low-k Polyimide Materials 429
8.4.7 Summary 442
REFERENCES 443
Appendix Unit of Measurement Conversion Table 453
作者簡介
楊士勇，中國科學院化學研究所研究員、博士生導師、國家973項目首席科學家、1999年度國家傑出青年基金獲得者、中國科學院“百人計畫”資助獲得者、中國科學院大學教授、享受國務院政府特殊津貼的專家。1982年畢業於蘭州大學化學系, 1985年在中國科學院化學研究所獲得碩士學位,1988年在南開大學獲得博士學位。1988-1992年在中國科學院上海有機化學研究所任助理研究員，1992-1996年先後在The University of New York at Buffalo 和The University of Chicago 從事博士後研究。1996年回國，在中國科學院化學研究所任副研究員、研究員。近年來主要致力於對於國家經濟建設和國防安全具有重要推動和促進作用的先進高分子材料的基礎和套用基礎研究。在碳纖維複合材料用耐高溫樹脂基體、耐高溫聚醯亞胺薄膜、耐高溫粘結劑、耐高溫工程塑膠、微電子製造與封裝材料等方向取得了多項令人注目的研究成績。
