基本介紹
- 中文名:2015年電氣與先進制造國際會議
- 外文名:ESAM2015
- 會議時間:2015年6月19日至20日
- 會議地點:南京市
會議簡介,會議宗旨,會議地點,會議主題,大會組委會,大會主席,技術評審委員會,會議出版,
會議簡介
會議宗旨
會議為師生,科研人員以及科學家提供面對面的交流平台,來共同交流並展現電氣與先進制造業及相關領域的最新科研成果,通過此次會議,來自不同領域的參與者會充分地交換最新的觀點和實用性的經驗,以此建立商業往來和建立科研合作,並尋求來自全球的未來商業夥伴。
會議地點
南京市
會議主題
Electrical Systems | Advanced Manufacturing Technology |
Electronics and Electrical Engineering Electromagnetic Compatibility Pulsed Power Technical and Applications Electromagnetic Field Computation Switch Technical Power Electronics and Drive Systems Power Conversion and Intelligent Control Electric Machines and System and Drives Power Engineering and Transmission & Distribution Environmental-Friendly Technologies for Power Generation New Power Sources and Applications Semiconductor Technical Power Market and Power System Economics Power System Stability and Reliability High Voltage and Insulation Technology Electrical Power Engineering Power Electronics AC-DC and DC-DC Converters AC and DC Motor Drives, inverters FM and PWM Techniques Utility Interface module for Power electronics Devices and Components Integration of Device and System Applications of Power electronics Single- and Multi-Phase Inverters Soft-Switched Techniques Modeling and Simulation of AC-DC Software Tools of AC-DC Converter/Inverter Topologies Automotive applications Power Factor Improvements FACTS and HVDC Circuits and Systems Automotive Electronics | Surface Engineering/Coatings Material Deformation Mechanics and Fracture Numerical Simulation for Material Preparation Emulation Technology for Material Preparation Free Forging and Die Forging Rolling and Drawing Forming Stamping and Sheet Metal Forming Extrusion Technology Powder Injection Molding Technology Extended Processing Technologies For Metal Wire Roll-Forming Technology Pipe and Tube Processing Technology Hydroforming and Hot Stamping Technology Rapid Prototyping and 3D Manufacturing Special Forming Techniques ( Wedge Rolling, Ring Rolling, Etc.) Rolls , Molds and Tooling Technology : Design, Manufacturing and Quality Control Modular, Flexible and Integrated Technology in Manufacturing Waste Disposal and Recycling Material Preparation Equipment and Auxiliary Equipment Technology Forging Furnace and Heating Technology CAD/CAE/CAM Micro- Forming and Micro-Manufacturing Modeling, Analysis and Simulation of Manufacturing Processes Materials Machining Welding & Joining Material Design of Comupter Aided Microwave Processing of Materials Thermal Engineering Theory and Applications CAM/CAE High-speed/Precision Machining and Inspection Technology Micro-Machining Technology Laser Processing Technology Bionic Mechanisms and Bio-manufacturing Virtual Manufacturing and Network Manufacturing Remanufacturing Engineering Sustainable Manufacturing Technologies Digital Manufacture and Management Quality Monitoring and Control of the Manufacturing Process System Analysis and Industrial Engineering Production and Operation Management Green Supply Chain Manufacturing E-commerce System |
大會組委會
大會主席
Dr. Bruce Moulton, University of Sydney Technology, Australia
技術評審委員會
Amiruddin Ismail, The National University of Malaysia (UKM) , Malaysia
Andrew Leung, City University of Hong Kong, China
Bhargava Lane, Roorkee University, India
CHEN Wei, Xi'an Jiaotong University, China
Fauziah Ahmad, University Sains Malaysia, Malaysia
Gabriel Badescu, North University of Baia Mare, Romania
HE Chengda, Yangzhou University, China
HU Dong, Nanjing University of Posts and Telecommunications, China
HUANG Jiazhu, Nanjing Normal University, China
Hui-Ming Wee, Chung Yuan Christian University in Taiwan, China
Jan Celko, University of Zilina, Slovak
JIANG Mingyan, Shandong University, China
LENG Hong, Harbin Institute of Technology, China
QIAN Zhihong, Jilin University, China
QIN Kun, Wuhan University, China
QU Shuying, Yantai University, China
S.L.Bhandarkar, Delhi Kannada Education Society, Lodhi Estate, New Delhi
SHEN Minfen, Shantou University, China
XIU Guangli, East China University of Science and Technology, China
ZOU Jingui, Wuhan University, China
Zhuo Yao, University of Cincinnati, U.S.A
會議出版
All registered papers will be published by World Scientific Publishing(世界科技出版社). The post conference proceedings will be included in the DOI, Google Scholar etc. and be sent to EICompendex for Indexing.
會議承諾
【關於會議】
- World Scientific Publishing(世界科技出版社)科技方面國際頂級出版機構。
- 審稿與註冊周期短:專業的審稿專家團隊,投稿後2-3周出審稿結果,錄用的文章即時開通註冊。
- 會議公開,透明:提供錄用通知檔案、機打發票,任何動態均在第一時間更新在網站上且告知作者。
- 往屆都已成功檢索
- 【截稿時間】:2015.05.30