1.van Driel WD, Fan XJ (Eds.). Solid State Lighting Reliability: Components to System. Springer, New York. 2012. Link 2. Fan, X.J. and Suhir, E. (eds). 2010. Moisture Sensitivity of Plastic Packages of IC Devices, Springer, New York. Link, front matter 3. Zhang, G..Q., van Driel, W.D., Fan, X.J., 2006. Mechanics of Microelectronics, Springer.
論文:
2013
1. Fan XJ, Yuan C. Effect of temperature gradient on moisture diffusion in high power devices and the applications in LED packages. Proc. of Electronic Components and Technology Conference (ECTC), Las Vegas, Nevada. May 28 -31, 1466-1470. 2013. PDF 2. Fan XJ. Multi-physics modeling in IC packaging and microsystems. Electronic Components and Technology Conference (ECTC), PDC course notes, Las Vegas, Nevada. May 28 -31, 2013. 3. Koh SW, Yuan CA, Sun B, Li B, Fan XJ, Zhang GQ. Product level accelerated lifetime test for indoor LED luminaires. Proc. 14th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2013), Wrosclaw, Poland. 2013. PDF 4. Cai M, Tian KM, Chen WB, Huang H, Tang HY, Liang LL, Yang DG, Fan XJ, Zhang GQ. A novel hybrid method for reliability prediction of high-power LED luminaires. Proc. 14th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2013), Wrosclaw, Poland. 2013. PDF 5. Sun B, Koh SW, Yuan CA, Fan XJ, Zhang GQ. Accelerated lifetime test for isolated components in linear drivers of high-voltage LED system. Proc. 14th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2013), Wrosclaw, Poland. 2013. PDF
樊學軍教授天津大學機械學院作學術報告