中國積體電路檢測和測試產業技術創新路線圖

基本介紹

  • 書名:中國積體電路檢測和測試產業技術創新路線圖
  • ISBN:9787121360589
  • 頁數:172頁
  • 定價:¥69.00
  • 出版時間:2019-04
  • 開本:16開
圖書信息,圖書目錄,

圖書信息

作譯者:積體電路測試儀器與裝備產業技術創新聯盟
中國積體電路檢測和測試產業技術創新路線圖中國積體電路檢測和測試產業技術創新路線圖
出版時間:2019-04
千 字 數:188
版次:01-01
頁 數:172
開本:16開
裝幀:
I S B N :9787121360589
紙質書定價:¥69.0

圖書目錄

第一章 積體電路工藝品質控制檢測技術與產品.........................................1
一、積體電路產業中的工藝品質控制概況··················································1
(一)積體電路產業鏈與工藝品質控制檢測布局································1
(二)工藝品質控制檢測技術和設備發展趨勢····································2
(三)工藝品質控制檢測設備市場整體情況········································4
二、矽製程(前道)中的關鍵工藝品質控制檢測技術與設備··················4
(一)圖形化表面檢測技術與設備························································7
(二)無圖形表面檢測技術與設備······················································20
(三)光刻套刻對準測量技術與設備··················································23
(四)其他分析及檢測技術與設備······················································25
(五)前道製程中的工藝品質控制檢測的整體發展趨勢··················26
三、晶圓級封裝(中道)中的關鍵工藝品質控制檢測技術與設備········29
(一)三維表面形貌測量技術與設備··················································30
(二)自動光學檢測技術與設備(中道)··········································35
(三)無圖形表面檢測技術與設備······················································37
(四)中道製程中的工藝品質控制檢測的整體發展趨勢··················37
四、基板與傳統封裝測試(後道)中的關鍵工藝品質控制檢測技術
與設備····································································································38
(一)自動光學檢測技術與設備(後道)········································· 38
(二)自動X 射線檢測技術與設備···················································· 41
(三)後道製程中的工藝品質控制檢測的整體發展趨勢················· 42
第二章 自動化測試設備技術與產品......................................................... 43
一、晶片/模組測試市場需求及發展趨勢·················································· 43
(一)電源管理類晶片的測試需求及趨勢········································· 47
(二)CIS 晶片的測試需求及趨勢······················································ 47
(三)邏輯/混合信號晶片的測試需求及趨勢···································· 49
(四)存儲器晶片的測試需求及趨勢················································· 52
(五)LCD Driver晶片的測試需求及趨勢········································· 54
二、ATE 自動測試機械手的現狀及發展方向··········································· 57
三、模擬及電源管理晶片ATE 設備發展現狀及趨勢······························ 59
四、邏輯/混合信號ATE 測試系統的發展現狀及趨勢····························· 60
五、存儲器ATE 測試系統的發展現狀及趨勢·········································· 62
六、LCD Driver 測試系統的發展現狀及趨勢··········································· 63
七、其他定製化專用積體電路測試設備發展的方向及趨勢··················· 65
八、SLT 測試技術的特點及行業發展前景··············································· 67
九、指紋晶片/模組的測試發展趨勢·························································· 69
十、MEMS晶片的測試發展趨勢······························································ 71
十一、與晶片可測性設計結合的ATE 設備一體化方案路線·················· 73
第三章 測試服務...................................................................................... 75
一、測試服務——平台技術······································································· 77
(一)整體技術需求············································································· 77
(二)發展趨勢····················································································· 77
(三)重點方向····················································································· 78
二、測試服務——共性技術······································································· 81
(一)整體技術需求············································································· 81
(二)重點方向····················································································· 82
(三)發展趨勢····················································································· 84
三、測試服務——產品測試解決方案························································84
(一)先進工藝IP 核測試解決方案····················································85
(二)先進封裝測試解決方案······························································87
(三)先進核心產品測試解決方案······················································90
第四章 軍用與民用積體電路測試差異性研究與技術發展....................... 102
一、整體技術需求······················································································102
二、發展趨勢······························································································103
三、重點方向······························································································105
(一)寬溫測試技術············································································105
(二)抗輻照測試技術········································································107
(三)電磁環境效應測試技術····························································110
(四)全參數、全功能測試技術························································113
(五)故障及失效測試技術································································115
(六)老煉試驗技術············································································117
(七)可測性設計與驗證技術····························································119
第五章 電力電子的測試技術與產品....................................................... 125
一、電力電子產品技術現狀······································································125
(一)功率二極體技術發展及產品····················································127
(二)功率MOSFET 技術發展及產品··············································129
(三)IGBT 技術發展及產品·····························································130
二、功率半導體器件測試技術··································································132
(一)功率半導體器件穩態參數測試················································132
(二)動態參數測試············································································134
(三)功率半導體器件UIS 雪崩耐量測試技術································146
(四)功率半導體器件熱阻測試技術················································150
三、功率半導體器件測試發展趨勢及路線圖··········································153
第六章 市場發展格局............................................................................. 155
一、全球封裝測試業··················································································156
(一)行業規模····················································································156
(二)產業布局··················································································· 157
(三)重點企業排名··········································································· 157
二、我國封裝測試業················································································· 158
(一)行業規模··················································································· 158
(二)產業布局··················································································· 159
(三)重點企業排名··········································································· 159

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