基本介紹
- 書名:中國積體電路檢測和測試產業技術創新路線圖
- ISBN:9787121360589
- 頁數:172頁
- 定價:¥69.00
- 出版時間:2019-04
- 開本:16開
圖書信息,圖書目錄,
圖書信息
作譯者:積體電路測試儀器與裝備產業技術創新聯盟
出版時間:2019-04
千 字 數:188
版次:01-01
頁 數:172
開本:16開
裝幀:
I S B N :9787121360589
紙質書定價:¥69.0
圖書目錄
第一章 積體電路工藝品質控制檢測技術與產品.........................................1
一、積體電路產業中的工藝品質控制概況··················································1
(一)積體電路產業鏈與工藝品質控制檢測布局································1
(二)工藝品質控制檢測技術和設備發展趨勢····································2
(三)工藝品質控制檢測設備市場整體情況········································4
二、矽製程(前道)中的關鍵工藝品質控制檢測技術與設備··················4
(一)圖形化表面檢測技術與設備························································7
(二)無圖形表面檢測技術與設備······················································20
(三)光刻套刻對準測量技術與設備··················································23
(四)其他分析及檢測技術與設備······················································25
(五)前道製程中的工藝品質控制檢測的整體發展趨勢··················26
三、晶圓級封裝(中道)中的關鍵工藝品質控制檢測技術與設備········29
(一)三維表面形貌測量技術與設備··················································30
(二)自動光學檢測技術與設備(中道)··········································35
(三)無圖形表面檢測技術與設備······················································37
(四)中道製程中的工藝品質控制檢測的整體發展趨勢··················37
四、基板與傳統封裝測試(後道)中的關鍵工藝品質控制檢測技術
與設備····································································································38
(一)自動光學檢測技術與設備(後道)········································· 38
(二)自動X 射線檢測技術與設備···················································· 41
(三)後道製程中的工藝品質控制檢測的整體發展趨勢················· 42
第二章 自動化測試設備技術與產品......................................................... 43
一、晶片/模組測試市場需求及發展趨勢·················································· 43
(一)電源管理類晶片的測試需求及趨勢········································· 47
(二)CIS 晶片的測試需求及趨勢······················································ 47
(三)邏輯/混合信號晶片的測試需求及趨勢···································· 49
(四)存儲器晶片的測試需求及趨勢················································· 52
(五)LCD Driver晶片的測試需求及趨勢········································· 54
二、ATE 自動測試機械手的現狀及發展方向··········································· 57
三、模擬及電源管理晶片ATE 設備發展現狀及趨勢······························ 59
四、邏輯/混合信號ATE 測試系統的發展現狀及趨勢····························· 60
五、存儲器ATE 測試系統的發展現狀及趨勢·········································· 62
六、LCD Driver 測試系統的發展現狀及趨勢··········································· 63
七、其他定製化專用積體電路測試設備發展的方向及趨勢··················· 65
八、SLT 測試技術的特點及行業發展前景··············································· 67
九、指紋晶片/模組的測試發展趨勢·························································· 69
十、MEMS晶片的測試發展趨勢······························································ 71
十一、與晶片可測性設計結合的ATE 設備一體化方案路線·················· 73
第三章 測試服務...................................................................................... 75
一、測試服務——平台技術······································································· 77
(一)整體技術需求············································································· 77
(二)發展趨勢····················································································· 77
(三)重點方向····················································································· 78
二、測試服務——共性技術······································································· 81
(一)整體技術需求············································································· 81
(二)重點方向····················································································· 82
(三)發展趨勢····················································································· 84
三、測試服務——產品測試解決方案························································84
(一)先進工藝IP 核測試解決方案····················································85
(二)先進封裝測試解決方案······························································87
(三)先進核心產品測試解決方案······················································90
第四章 軍用與民用積體電路測試差異性研究與技術發展....................... 102
一、整體技術需求······················································································102
二、發展趨勢······························································································103
三、重點方向······························································································105
(一)寬溫測試技術············································································105
(二)抗輻照測試技術········································································107
(三)電磁環境效應測試技術····························································110
(四)全參數、全功能測試技術························································113
(五)故障及失效測試技術································································115
(六)老煉試驗技術············································································117
(七)可測性設計與驗證技術····························································119
第五章 電力電子的測試技術與產品....................................................... 125
一、電力電子產品技術現狀······································································125
(一)功率二極體技術發展及產品····················································127
(二)功率MOSFET 技術發展及產品··············································129
(三)IGBT 技術發展及產品·····························································130
二、功率半導體器件測試技術··································································132
(一)功率半導體器件穩態參數測試················································132
(二)動態參數測試············································································134
(三)功率半導體器件UIS 雪崩耐量測試技術································146
(四)功率半導體器件熱阻測試技術················································150
三、功率半導體器件測試發展趨勢及路線圖··········································153
第六章 市場發展格局............................................................................. 155
一、全球封裝測試業··················································································156
(一)行業規模····················································································156
(二)產業布局··················································································· 157
(三)重點企業排名··········································································· 157
二、我國封裝測試業················································································· 158
(一)行業規模··················································································· 158
(二)產業布局··················································································· 159
(三)重點企業排名··········································································· 159