鍵合金球剪下測試（BST）是另一種評價金球鍵合力度的方法。該方法為拉線測試的補充方法，但卻不能代替拉線測試。這是因為在鍵合過程中表現出的失效機理在剪下測試中有較大的體現，而在拉線測試中只有較小的影響。
簡介,剪下測試相關國際標準,
簡介
Bond shear testing (BST) is another test method for assessing the strength of a ball bond. This test complements, but does not substitute, wire pull testing. This is because of the existence of failure mechanisms wherein the bond exhibits a high bond shear strength but offers very little resistance to wire pull stresses.
A bond shear tester is needed to perform the bond shear test. This equipment consists of a sample holder, a shearing arm with a chisel-shaped tool at the end, and an instrument for measuring the shear strength of the bond.
進行鍵合剪下測試需要有相應的設備。該設備包括：測試樣品裝載裝置，剪下臂，剪下臂末端需有一剪下用刀頭，以及可以測量剪下力度的讀數裝置。
Initially, the shearing tool is positioned beside the ball bond to be tested. The shearing arm then moves the tool horizontally against the ball, in effect pushing the ball off its bond pad. The force needed to shear a ball off its pad, known as the bond shear force, is then measured by the ball shear tester.
初始時，剪下刀頭需位於待剪下金球的側方。剪下刀頭需水平的推向待剪下帶金球，直至將金球從鍵合表面（bond pad）推離開。當金球被推離鍵合表面時代力度即為鍵合金球剪下力度，其應被剪下設備所記錄。
The shear force reading of a ball bond must be correlated with its ball diameter for proper assessment of its ball shear strength. On the other hand, the shear force reading of a wedge bond must be correlated with the tensile strength of the wire for proper assessment of its wedge shear strength.
剪下力度應與金球直徑相關（金球直徑的設定應考慮到鍵合點需要承受的力度）。同樣，在楔形線腳處的剪下力度需與金線的抗張強度相關。
The bond shear failure mode observed during bond shear testing must also be noted. Bond shear failure modes include the following: 1) bond lifting; 2) bond shearing; 3) cratering; 4) bonding surface lifting (separation of the bonding surface from its underlying substrate). Misplacement of the shearing tool produces invalid bond shear failures, the shear force readings of which must be excluded from analysis.
金球剪下失效模式同樣需要被記錄，為如下之一，1）金球掀起，2）金球被推離，3）火山口（金球被推離表面，帶起晶片表面，導致晶片材料-矽顯露出來，形成火山口一樣的凹坑——NovHeaven），4）鍵合表面分離（鍵合表面與晶片材料之間的分離）。因剪下刀頭放置位置錯誤而產生的讀數是無效的，不應供分析使用。
以上英文內容來自網站：www.siliconfareast.com，中文翻譯出自NovHeaven。
剪下測試一般用於半導體封裝流程的前段，其為監控生產能力與穩定性的重要標準之一，一般為SPC測試中的重要一項。
剪下測試相關國際標準
EIA/JESD22-B116 （該標準為網際網路免費共享，無需購買）。
