張墅野

個人經歷

教育經歷

2017.9-2019.8哈爾濱工業大學國際交流計畫(引進項目)博士後

2014.9-2017.8KAIST材料科學與工程博士

2012.9-2014.8KAIST材料科學與工程碩士

2008.9-2012.8哈爾濱工業大學電子封裝技術專業本科

工作經歷

2017.9-至今哈爾濱祖騙敬盼工業大學電子封裝技術專業講師

審稿工作

國家自然科學基金委漿臭背員照組熱承會ISIS系統評議專家(2020-至今)

學術任職：

國際電子封裝學會(IMAPS)《Journal of Microelectronics and Electronic Packaging》雜誌副主編

中國微米納米技術學會高級會員

中國機械工程學會焊接分會青年工作委員會委員

客座編輯 Journal of Nanomaterial Special Issue on Functional Materials for Printable, Flexible and Stretchable Electronics (2020)

合作編著 "Hybrid Nanomaterials" in Intechopen

2018 The 20th International Conference on Electronic Materials and Packaging (EMAP) - Steering committee member

2018 IEEE 3M-NANO University of Shanghai Cooperation Organization Nanotechnology - Session Chair

2018 The 13th Graduate Student Symposium on Materials Science and Engineering - Academic Committee Member

2019 The 19th IEEE International Conference on Nanotechnology- Nanoelectronics - Session Chair

2019 IEEE 3M-NANO University of Shanghai Cooperation Organization Nanotechnology - Session Chair

2019 The 21th International Conference on Electronic Materials and Packaging (EMAP) - Steering committee member

2019 The 13th IEEE International Conference on Nano/Molecular Medicine & Engineering- Technical Committee Member

審稿工作：

ACS Applied Matierlas & Interfaces, Advanced Materials, Journal of Materials Chemistry C, Materials & Design, Journal of Alloys and Compounds, IEEE Access, Nanotechnology, Journal of Materials Science, Journal of Materials Research and Technology, Materialia, Polymer Testing, Journal of Materials Science: Materials in Electronics, Microelectronics Reliability, Journal of Electronic Materials, IEEE Transactions on Components, Packaging and Manufacturing Technology 等國際期刊審稿人。

研究方向

1. 柔性及印刷電子製備

2. 極端條件下"器件抹主夜"可靠性

3. 微小焊點可靠性

主講課程

課堂準入講授課程：

1.《表面組裝技術》-電子封裝技術專業本科生課程

2.《電子封裝技術專業生產實習》-電子封裝技術專業大四生產實希捆祖習

榮譽獎項

2019 河簽采兵南省科學技術進步二等獎

2019 中國機械工業科學技術科技悼舟進步三等獎

學術成果

科研項目

項目名稱可穿戴電子釺料-ACF焊點的等溫時效與電遷移研究

項目來源國家自然科學基金委員會

開始時間2019.01.01

結束時間2021.12.31

擔任角色負責

項目類別縱向項目

項目狀態進行中

項目名稱微混裝焊點的可靠性及其失效機理研究

項目來源中國博士後科學基金會

開始時間2019.06

結束時間2021.06

擔任角色負責

項目類別縱向項目

項目狀態進行中

項目名稱微小焊點的電遷移研究

項目來源哈爾濱工業大學先進焊接與連線國家重點實驗室

開始時間2019.01.01

結束時間2020.12.31

擔任角色負責

項目類別縱向項目

項目狀態進行中

項目名稱電子信息製造產業用軟釺焊膏質量評價及關鍵技術標準研究

項目來源國家重點研發計畫

開始時間2019.12

結束時間2021.11

擔任角色參與

項目類別縱向項目

項目狀態進行中

期刊論文

Xu J, Gao D, Wang X, Zhou X, Zhu B, Qi X, Sekulic D., He P*, Li Z, Lin T, Zhang S*. Joining ZnS ceramics by using PbTiO3 doped PbO-B2O3-ZnO[J]. Journal of Materials Science, 2020. In press 中科院2區Top期刊（材料科學）

Shen L, Li Z*, Feng G, Zhang S*, Zhou Z, He P*. Self-propagating Synthesis joining of Cf/Al composites and TC4 alloy using AgCu filler with Ni-Al-Zr interlayer[J]. Rare Metals, 2020. In press 中國科技期刊卓越行動計畫

Wang Q, Zhang S*, Liu G, Lin T*, He P*. The mixture of silver nanowires and nanosilver-coated copper micronflakes for electrically conductive adhesives to achieve high electrical conductivity with low percolation threshold[J]. Journal of Alloys and Compounds, 2020, 820: 153184. 中科院2區Top期刊（材料科學）

Zhang S, Xu S, Gao H, Lu Q, Lin T*, He P*, Geng H*. Characterization of multiple-filled skutterudites with high thermoelectric performance[J]. Journal of Alloys and Compounds, 2020, 814: 152272. 中科院2區Top期刊（材料科學）

Zhang S, Zhang X, Lu Q, He P*, Lin T*, Geng H*. Investigation of melt-spinning speed on the property of Yb0.2Ba0.1Al0.1Ga0.1In0.1La0.05Eu0.05Co3.75Fe0.25Sb12 skutterudites[J]. Materials Letters, 2020, 260: 126960.

Jin T, Pan Y, Jeon G-J, Yeom H-I, Zhang S, Paik K-W, Park S-H K*. Ultrathin Nanofibrous Membranes Containing Insulating Microbeads for Highly Sensitive Flexible Pressure Sensors[J]. ACS applied materials & interfaces, 2020, 12(11): 13348–13359. 中科院1區Top期刊（材料科學）

Xie C, Ding R*, Wang X, Hu C, Yan J, Zhang W, Wang Y, Qu Y, Zhang S, He P, Wang Z*. A disulfiram-loaded electrospun poly(vinylidene fluoride) nanofibrous scaffold for cancer treatment[J]. Nanotechnology, 2020, 31(11): 115101. 中科院2區Top期刊（工程技術）

Song L, Yoon D-J, Zhang S, Paik K-W*. A Study on Polyvinylidene Difluoride (PVDF) Anchoring Polymer Layer (APL) Solder Anisotropic Conductive Films (ACFs) for Fine Pitch Flex-on-Flex (FOF) Interconnection[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 10(3): 1–1. IEEE CPMT最受歡迎文章第12名 (Popupar Article March 2020)

Du Q, Wang X*, Zhang S, Long W, Zhang L, Jiu Y, Yang C, Zhang Y, Yang J. Research status on surface metallization of diamond[J]. Materials Research Express, 2020, 6(12): 122005. Topical Review

Zhang S, Liu X, Lin T*, He P*. A method to fabricate uniform silver nanowires transparent electrode using Meyer rod coating and dynamic heating[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(20): 18702–18709.

Zhang S*, Zhu B, Zhou X, Wang X, Lin T*, He P*, Paik K W. Wettability and interfacial morphology of Sn–3.0Ag–0.5Cu solder on electroless nickel plated ZnS transparent ceramic[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(19): 17972–17985.

Xu S, Qi X, Xu X, Wang X, Yang Z, Zhang S*, Lin T*, He P*. Effects of electroless nickel plating method for low temperature joining ZnS ceramics[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(16): 15236–15249.

Zhang S, Xu X, Lin T, He P*. Recent advances in nano-materials for packaging of electronic devices[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(15): 13855–13868.

Zhang S*, Qi X, Yang M, Cao Y, Lin T, He P, Paik K W. A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(10): 9171–9183.

張墅野，徐翔宇，林鐵松，何鵬. 熔體電紡在加工生物材料方面的套用[J], 中國醫療器械信息，2019

張墅野，許孫武，曹洋，林鐵松，何鵬. 新型導電膠中銅粉表面化學鍍納米銀顆粒的導電機理研究[J]. 焊接, 2019 (2): 1.

Zhao D, Huang W C, Guo N, Zhang S, Xue C, Mao X*. Two-step separation of chitin from shrimp shells using citric acid and deep eutectic solvents with the assistance of microwave[J]. Polymers, 2019, 11(3): 409.

Wang J, Zhang S, Shi Z, Jiu J, Wu C, Sugahara T, Nagao S, Suganuma K, He P*. Nanoridge patterns on polymeric film by a photodegradation copying method for metallic nanowire networks[J]. RSC Advances, 2018, 8(71): 40740–40747.

Wang J, Jiu J, Zhang S, Sugahara T, Nagao S, Suganuma K, He P*. The comprehensive effects of visible light irradiation on silver nanowire transparent electrode[J]. Nanotechnology, 2018, 29(43): 435701. 中科院2區Top期刊（工程技術）

Yang M, Kim S W, Zhang S, Park D Y, Lee C W, Ko Y H, Yang H, Xiao Y, Chen G, Li M. Facile and highly efficient fabrication of robust Ag nanowire-elastomer composite electrodes with tailored electrical properties[J]. Journal of Materials Chemistry C, 2018, 6(27): 7207–7218. Inside backcover

Jin M L, Park S, Kim J-S, Kwon S H, Zhang S, Yoo M S, Jang S, Koh H-J, Cho S-Y, Kim S Y, Ahn C W, Cho K, Lee S G, Kim D H, Jung H-T. Sensors: An Ultrastable Ionic Chemiresistor Skin with an Intrinsically Stretchable Polymer Electrolyte (Adv. Mater. 20/2018)[J]. Advanced Materials, 2018, 30(20): 1870140. Frontispiece

Jin M L, Park S, Kim J S, Kwon S H, Zhang S, Yoo M S, Jang S, Koh H J, Cho S Y, Kim S Y, Ahn C W, Cho K, Lee S G, Kim D H, Jung H T. An Ultrastable Ionic Chemiresistor Skin with an Intrinsically Stretchable Polymer Electrolyte[J]. Advanced Materials, 2018, 30(20): 1706851. 中科院1區Top期刊（材料科學）

Zhang S, Yang M, Wu Y, Du J, Lin T, He P, Huang M, Paik K W*. A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250°C Bonding Temperature[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018, 8(3): 383–391.

Zhang S*, Yang M, Jin M, Huang W C, Lin T, He P, Lin P, Paik K W. Mechanism of solder joint cracks in anisotropic conductive films bonding and solutions: Delaying hot-bar lift-up time and adding silica fillers[J]. Metals, 2018, 8(1): 42.

Zhang S, Lin T, He P, Zhao N, Huang M, Paik K W. A study on the bonding conditions and nonconductive filler contents on cationic epoxy-based Sn-58Bi solder ACFs joints for reliable flex-on-board applications[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 7(12): 2087–2094.

Pan Y, Song L, Zhang S, Cai X, Paik K W*. Effects of Polymer Conductive Particle Contents on the Electrical Performance and Reliability of 50- μm Pitch Flex-on-Flex Assemblies Using Anisotropic Conductive Films[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 7(11): 1759–1764.

Zhang S*, Lin T, He P, Paik K W. Effects of acrylic adhesives property and optimized bonding parameters on Sn–58Bi solder joint morphology for flex-on-board assembly[J]. Microelectronics Reliability, 2017, 78: 181–189.

Kim J, Kim J, Song S, Zhang S, Cha J, Kim K, Yoon H, Jung Y, Paik K W, Jeon S*. Strength dependence of epoxy composites on the average filler size of non-oxidized graphene flake[J]. Carbon, 2017, 113: 379–386. 中科院1區Top期刊（材料科學）

Yang M, Ko Y H, Bang J, Kim T S, Lee C W, Zhang S, Li M. Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5grains on Cu substrates[J]. Journal of Alloys and Compounds, 2017, 701: 533–541. 中科院2區Top期刊（材料科學）

Kim T W, Lee T I, Pan Y, Kim W, Zhang S, Kim T S, Paik K W*. Effect of nanofiber orientation on nanofiber solder anisotropic conductive films joint properties and bending reliability of flex-on-flex assembly[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(9): 1317–1329.

Zhang S, Park J H, Paik K W. Joint morphologies and failure mechanisms of Anisotropic Conductive Films (ACFs) during a power handling capability test for flex-on-board applications[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(12): 1820–1826.

Park J H, Kim T W, Zhang S, Paik K W*. Effects of polymer ball size and polyvinylidene fluoride nanofiber on the ball capture rate for 100-μm -pitch flex-on-flex assembly using anisotropic conductive films and ultrasonic bonding method[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(7): 1129–1136.

Zhang S, Paik K W*. A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(2): 216–223.

Kim Y-S, Zhang S, Paik K-W*. Highly Reliable Solder ACFs FOB (Flex-on-Board) Interconnection Using Ultrasonic Bonding[J]. Journal of the Microelectronics and Packaging Society, 2015, 22(1): 35–41.

Zhang S, Kim S H, Kim T W, Kim Y S, Paik K W. A study on the solder ball size and content effects of solder ACFs for flex-on-board assembly applications using ultrasonic bonding[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015, 5(1): 9–14.

會議論文

S.Zhang,M.Yang,T.Lin,P.He,K.Paik: A Study on the Optimization of O2 Plasma Parameters on the Peel Adhesion Strength and Solder Wettability of SnBi58 based Anisotropic Conductive Films. 2019 IEEE 69th Electronic Components and Technology Conference (ECTC); Las Vegas, NV, USA, May 28-31, 2019, Interactive presentation. 領域頂級國際會議 EI檢索

S.Zhang,T.Lin,P.He,J.Park,G.Park,H.Song,J.Kim,K.Paik: A Study on the High-Frequency Performance of Solder ACFs Joints for Flex-on-Board Applications Using Coplanar Waveguide. 2018 IEEE 68th Electronic Components and Technology Conference (ECTC); San Diego, USA, 05/2018, Interactive presentation. 領域頂級國際會議 EI檢索

S.Zhang and K.Paik*, "The Effect of Polymer Rebound on SnBi58 Solder ACFs Joints Cracks during a Thermo-Compression Bonding," 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2017, pp. 2047-2053. Interactive presentation. 領域頂級國際會議 EI檢索

S.Zhang and K.Paik*: Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability. 2016 IEEE 66th Electronic Components and Technology Conference (ECTC); Florida USA, 05/2017, Oral presentation. 領域頂級國際會議 EI檢索

S.Zhang,X.Liu,T.Lin,P.He: Atomic Layer of ZnO Deposition on Ag Nanowires for Novel Electrical Applications. the 19th IEEE International Conference on Nanotechnology (IEEE-NANO 2019), July 22-26, 2019, The Parisian Macao, Macau SAR, China, Oral presentation. 領域頂級國際會議 EI檢索

S.Zhang,Y.Zhang,T.Lin,P.He: Pulsed Laser Deposited MoS2 for the Fabrication of MoS2/Graphene Photodetector. the 19th IEEE International Conference on Nanotechnology (IEEE-NANO 2019), July 22-26, 2019, The Parisian Macao, Macau SAR, China, Poster presentation. 領域頂級國際會議 EI檢索

S.Zhang, M.Yang, Y. Zhang, Q. Wang, T. Lin, P. He and K. Paik, "A Study on the Preparation and Properties of Conductive Adhesives Filled with Multi-component Fillers for Green Packaging" 2018 IEEE 20th International Conference on Electronics Materials and Packaging (EMAP), HKUST, HK, 2018, Oral presentation, including poster. 領域頂級國際會議 EI檢索

S.Zhang and P.He*: 3D printed magnetic hydrogels for biomedical applications, 2019 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 4-8 August 2019, Zhenjiang, China, Invited Oral Presentation

P.He and S.Zhang*: Enhanced Mechanical and Transparent Properties of Conductive Hydrogels for Stretchable Application, 2019 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 4-8 August 2019, Zhenjiang, China, Invited Oral Presentation

S.Zhang and P.He*: Nanoridge patterns on polymeric film by photocopying metallic nanowire networks, The 8th IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, Hangzhou, China, 13-17 August, 2018, Invited Oral Presentation

P.He and S.Zhang*: Visible light irradiation of silver nanowire transparent electrode: a double-edged sword, The 8th IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, Hangzhou, China, 13-17 August, 2018, Invited Oral Presentation

S.Zhang, M.Yang, T.Lin, P.He and K.Paik,"Wettability and Mechanical Strength of Sn-3Ag-0.5Cu solders on Ni plated ZnS Ceramics" 2019 21th International Conference on Electronics Materials and Packaging (EMAP), Busan, Korea, 2019, Oral presentation.

S.Zhang, K.Paik*: Effects of Conductive Particles on the Power Handling Capability of ACFs Interconnection for Flex-On-Board Applications. The 15th International Symposium on Microelectronics and Packaging, KINTEX, Seoul, Korea, 2016, Oral presentation.

S.Zhang, K.Paik*: Mechanism of solder crack of Anisotropic Conductive Films (ACFs) joint caused by Ultrasonic Horn Releasing Time during Cooling Process Using Thermomechanical Analysis. The 14th International Symposium on Microelectronics and Packaging, KINTEX, Ilsan, Korea, 2015, Poster

Y.Ming,D.Park,C.Lee,Y.Ko*,S.Zhang*,T.Lin,P.He*: Fabrication of Ag nanowire-elastomer composite electrodes with tailored electrical properties by using a 3D mask. International Conference on flexible electronics, Hangzhou, China, 2018, Best Poster Award 首屆柔性電子大會最佳海報獎

S.Zhang,Z.Shi,C.Yu,T.Lin,P.He,W.Long,L.Bao,J.Ma: A Study of PEDOT:PSS Layer on the Enhanced Reliability of Silver Nanowires for Transparent Electrodes, Shenyang, China, 2018, Oral presentation

S.Zhang, Y.Zhang, Q.Wang,T.Lin,P.He,W.Long,L.Bao,J.Ma: Preparation and Properties of Two-component Filler Filled Conductive Adhesive, Shenyang, China, 2018

S.Xu,S.Zhang,Y.Cao,T.Lin,P.He,W.Long,L.Bao,J.Ma: A Study on the Conductive Mechanism of Silver Coated Copper Powders for Conductive Adhesives, Shenyang, China, 2018

S.Xu,Q.Lu,H.Geng,T.Lin,P.He,S.Zhang*: A Study on the Annealing and Melt-spinning on the Enhancement of Thermoelectric Properties of Multiple-filled Skutterudites Followed by Hot Pressing, Wiley Soochow University International Conference on Energy Materials, Suzhou, China, 2018, 21-23 December.

張墅野

基本介紹

個人經歷

研究方向

主講課程

榮譽獎項

學術成果

研究方向

主講課程

榮譽獎項

學術成果

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